<?xml version="1.0" encoding="UTF-8"?>
<reference anchor="I-D.boro-opsawg-ntw-attachment-circuit" target="https://datatracker.ietf.org/doc/html/draft-boro-opsawg-ntw-attachment-circuit-03">
   <front>
      <title>A Network YANG Data Model for Attachment Circuits</title>
      <author initials="M." surname="Boucadair" fullname="Mohamed Boucadair">
         <organization>Orange</organization>
      </author>
      <author initials="R." surname="Roberts" fullname="Richard Roberts">
         <organization>Juniper</organization>
      </author>
      <author initials="O. G." surname="de Dios" fullname="Oscar Gonzalez de Dios">
         <organization>Telefonica</organization>
      </author>
      <author initials="S." surname="Barguil" fullname="Samier Barguil">
         <organization>Nokia</organization>
      </author>
      <author initials="B." surname="Wu" fullname="Bo Wu">
         <organization>Huawei Technologies</organization>
      </author>
      <date month="September" day="5" year="2023" />
      <abstract>
	 <t>   This document specifies a network model for attachment circuits.  The
   model can be used for the provisioning of attachment circuits prior
   or during service provisioning (e.g., Network Slice Service).  A
   companion service model is specified in
   [I-D.boro-opsawg-teas-attachment-circuit].

   The module augments the Service Attachment Point (SAP) model with the
   detailed information for the provisioning of attachment circuits in
   Provider Edges (PEs).

	 </t>
      </abstract>
   </front>
   <seriesInfo name="Internet-Draft" value="draft-boro-opsawg-ntw-attachment-circuit-03" />
   
</reference>
