Multi-encapsulation interconnection for Overlay Virtual Network
draft-ao-nvo3-multi-encap-interconnect-00

Document Type Expired Internet-Draft (individual)
Authors Ting Ao  , Greg Mirsky  , Fan Yongbing 
Last updated 2018-09-02 (latest revision 2018-03-01)
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This Internet-Draft is no longer active. A copy of the expired Internet-Draft can be found at
https://www.ietf.org/archive/id/draft-ao-nvo3-multi-encap-interconnect-00.txt

Abstract

For an virtualized overlay network, there are many encapsulations that may be used. Different customer have their own preference. So if some of these different encapsulation can be interconnected together, the virtualized overlay network would be more compatible and have loose strict on access. This document is going to provide an architecture of different overlay encapsulation interconnection and an tranformer gateway for these end station connected to the virtual network.

Authors

Ting Ao (ao.ting@zte.com.cn)
Greg Mirsky (gregimirsky@gmail.com)
Fan Yongbing (fanyb@gsta.com)

(Note: The e-mail addresses provided for the authors of this Internet-Draft may no longer be valid.)