Signaling Virtual Circuit Label Using RSVP-TE
draft-cai-vc-rsvp-te-00

Document Type Expired Internet-Draft (individual)
Last updated 2001-02-27
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This Internet-Draft is no longer active. A copy of the expired Internet-Draft can be found at
https://www.ietf.org/archive/id/draft-cai-vc-rsvp-te-00.txt

Abstract

This document proposes an extension to RSVP-TE to distribute VC labels required by L2 circuit over MPLS encapsulation proposed by Martini et. al. The distribution of VC labels is piggybacked on signaling of LSP tunnels using two new RSVP objects.

Authors

Martin Machacek (martin.machacek@terabeam.com)
Ting Cai (tingcai@microsoft.com)

(Note: The e-mail addresses provided for the authors of this Internet-Draft may no longer be valid.)