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draft-ietf-rtgwg-srv6-egress-protection@ietf.org
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liulei.kddi@gmail.com, huaimo.chen@futurewei.com, baggio.wupeng@huawei.com, caoc15@chinaunicom.cn, xufeng.liu.ietf@gmail.com, chenhn8.gd@chinatelecom.cn, mehmet.toy@verizon.com |
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draft-ietf-rtgwg-srv6-egress-protection.authors@ietf.org
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liulei.kddi@gmail.com, huaimo.chen@futurewei.com, baggio.wupeng@huawei.com, caoc15@chinaunicom.cn, xufeng.liu.ietf@gmail.com, chenhn8.gd@chinatelecom.cn, mehmet.toy@verizon.com |
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draft-ietf-rtgwg-srv6-egress-protection.chairs@ietf.org
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yingzhen.ietf@gmail.com, jefftant.ietf@gmail.com |
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draft-ietf-rtgwg-srv6-egress-protection.ad@ietf.org
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aretana.ietf@gmail.com, andrew-ietf@liquid.tech, jgs@juniper.net |
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draft-ietf-rtgwg-srv6-egress-protection.all@ietf.org
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liulei.kddi@gmail.com, huaimo.chen@futurewei.com, baggio.wupeng@huawei.com, jgs@juniper.net, caoc15@chinaunicom.cn, xufeng.liu.ietf@gmail.com, chenhn8.gd@chinatelecom.cn, aretana.ietf@gmail.com, jefftant.ietf@gmail.com, yingzhen.ietf@gmail.com, andrew-ietf@liquid.tech, mehmet.toy@verizon.com |