Path Layer UDP Substrate Specification
draft-trammell-plus-spec-01
| Document | Type | Expired Internet-Draft (individual) | |
|---|---|---|---|
| Last updated | 2017-09-14 (latest revision 2017-03-13) | ||
| Stream | (None) | ||
| Intended RFC status | (None) | ||
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https://www.ietf.org/archive/id/draft-trammell-plus-spec-01.txt
Abstract
This document specifies a common Path Layer UDP Substrate (PLUS) wire image for encrypted transport protocols carried over UDP. The base PLUS header carries information for driving a minimal state machine at middleboxes described in [I-D.trammell-plus-statefulness], and provides optional exposure of additional information to devices along the path using the mechanism described in [I-D.trammell-plus-abstract-mech].
Authors
Brian Trammell
(ietf@trammell.ch)
Mirja Kühlewind
(mirja.kuehlewind@tik.ee.ethz.ch)
(Note: The e-mail addresses provided for the authors of this Internet-Draft may no longer be valid.)