Path Layer UDP Substrate Specification
draft-trammell-plus-spec-01

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Last updated 2017-09-14 (latest revision 2017-03-13)
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This Internet-Draft is no longer active. A copy of the expired Internet-Draft can be found at
https://www.ietf.org/archive/id/draft-trammell-plus-spec-01.txt

Abstract

This document specifies a common Path Layer UDP Substrate (PLUS) wire image for encrypted transport protocols carried over UDP. The base PLUS header carries information for driving a minimal state machine at middleboxes described in [I-D.trammell-plus-statefulness], and provides optional exposure of additional information to devices along the path using the mechanism described in [I-D.trammell-plus-abstract-mech].

Authors

Brian Trammell (ietf@trammell.ch)
Mirja K├╝hlewind (mirja.kuehlewind@tik.ee.ethz.ch)

(Note: The e-mail addresses provided for the authors of this Internet-Draft may no longer be valid.)