xDSL Multi-Pair Bonding (G.Bond) MIB
RFC 6765

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Internet Engineering Task Force (IETF)                          E. Beili
Request for Comments: 6765                              Actelis Networks
Category: Standards Track                                 M. Morgenstern
ISSN: 2070-1721                                              ECI Telecom
                                                           February 2013

                  xDSL Multi-Pair Bonding (G.Bond) MIB

Abstract

   This document defines a Management Information Base (MIB) module for
   use with network management protocols in TCP/IP-based internets.
   This document defines an extension to the Interfaces Group MIB with a
   set of common objects for managing multi-pair bonded Digital
   Subscriber Line (xDSL) interfaces, as defined in ITU-T
   Recommendations G.998.1, G.998.2, and G.998.3.  The textual
   conventions defining the bonding schemes are contained in a separate
   MIB module maintained by Internet Assigned Numbers Authority (IANA).
   The MIB modules specific to each bonding technology are defined in
   G9981-MIB, G9982-MIB, and G9983-MIB, respectively.

Status of This Memo

   This is an Internet Standards Track document.

   This document is a product of the Internet Engineering Task Force
   (IETF).  It represents the consensus of the IETF community.  It has
   received public review and has been approved for publication by the
   Internet Engineering Steering Group (IESG).  Further information on
   Internet Standards is available in Section 2 of RFC 5741.

   Information about the current status of this document, any errata,
   and how to provide feedback on it may be obtained at
   http://www.rfc-editor.org/info/rfc6765.

Beili & Morgenstern          Standards Track                    [Page 1]
RFC 6765                       G.Bond MIB                  February 2013

Copyright Notice

   Copyright (c) 2013 IETF Trust and the persons identified as the
   document authors.  All rights reserved.

   This document is subject to BCP 78 and the IETF Trust's Legal
   Provisions Relating to IETF Documents
   (http://trustee.ietf.org/license-info) in effect on the date of
   publication of this document.  Please review these documents
   carefully, as they describe your rights and restrictions with respect
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   include Simplified BSD License text as described in Section 4.e of
   the Trust Legal Provisions and are provided without warranty as
   described in the Simplified BSD License.

Table of Contents

   1. Introduction ....................................................3
   2. The Internet-Standard Management Framework ......................4
   3. The Broadband Forum Management Framework for xDSL Bonding .......4
   4. Relationship to Other MIB Modules ...............................5
      4.1. Relationship to Interfaces Group MIB Module ................5
           4.1.1. Layering Model ......................................5
           4.1.2. xDSL Bonding ........................................7
           4.1.3. Discovery Operation .................................8
           4.1.4. Initialization of G.Bond Ports .....................10
           4.1.5. Usage of the ifTable ...............................11
      4.2. Relationship to G.Bond ATM, ETH, and TDIM MIB Modules .....13
      4.3. Relationship to xDSL MIB Modules ..........................13
      4.4. Addition of New Bonding Schemes ...........................13
   5. MIB Structure ..................................................13
      5.1. Overview ..................................................13
      5.2. Performance Monitoring ....................................14
      5.3. Mapping of Broadband Forum TR-159 Managed Objects .........14
   6. xDSL Multi-Pair Bonding MIB Definitions ........................19
   7. IANA-Maintained G.Bond TC Definitions ..........................65
   8. Security Considerations ........................................67
   9. IANA Considerations ............................................69
   10. Acknowledgments ...............................................69
   11. References ....................................................70
      11.1. Normative References .....................................70
      11.2. Informative References ...................................71

Beili & Morgenstern          Standards Track                    [Page 2]
RFC 6765                       G.Bond MIB                  February 2013

1.  Introduction

   xDSL Multi-pair bonding allows a service provider to provide high-
   bandwidth services to business and residential customers over
   multiple xDSL lines, with greater speed and resiliency than service
   over a single xDSL line, bridging the gap between xDSL and fiber-
   based transport.

   Currently, there are three xDSL Multi-pair bonding schemes, also
   known under the collective name "G.Bond":

   o  ATM-Based Multi-pair bonding, as specified in ITU-T Recommendation