History for IPR disclosure
Cisco's Patent Pending Statement Regarding draft-hakala-diameter-credit-control-xx.txt Entitled 'Diameter Credit Control Application'
| Date | Type | By | Text |
|---|---|---|---|
| 2003-04-15 | Posted | (System) | IPR Disclosure Posted |
| 2003-04-15 | Submitted | (System) | IPR Disclosure Submitted |
| 2003-04-15 | Legacy | (System) |
From: http://www.ietf.org/ietf-ftp/IPR/cisco-hakala-diameter.txt Received: April 15, 2003 From: Robert Barr, <rbarr@cisco.com> Subject: RFC 2026 statement re draft-hakala-diameter-credit-control-XX.txt Cisco has a pending patent application related … From: http://www.ietf.org/ietf-ftp/IPR/cisco-hakala-diameter.txt
Received: April 15, 2003 From: Robert Barr, <rbarr@cisco.com> Subject: RFC 2026 statement re draft-hakala-diameter-credit-control-XX.txt Cisco has a pending patent application related to the subject matter of "Diameter Credit Control Application" <draft-hakala-diameter-credit-control-XX.txt>. If technology in this document is included in a standard adopted by the IETF and any claims of any Cisco patents are necessary for practicing this standard, any party will be able to obtain a license from Cisco to use any such patent claims under reasonable, non-discriminatory terms to implement and fully comply with the standard. For information contact: Robert Barr Worldwide Patent Counsel Cisco Systems 408-525-9706 rbarr@cisco.com |