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History for IPR disclosure
Cisco's Patent Pending Statement Regarding draft-hakala-diameter-credit-control-xx.txt Entitled 'Diameter Credit Control Application'

Date Type By Text
2003-04-15 Posted (System) IPR Disclosure Posted
2003-04-15 Submitted (System) IPR Disclosure Submitted
2003-04-15 Legacy (System)
From: http://www.ietf.org/ietf-ftp/IPR/cisco-hakala-diameter.txt

Received: April 15, 2003
From: Robert Barr, <rbarr@cisco.com>

Subject: RFC 2026 statement re draft-hakala-diameter-credit-control-XX.txt

Cisco has a pending patent application related …
From: http://www.ietf.org/ietf-ftp/IPR/cisco-hakala-diameter.txt

Received: April 15, 2003
From: Robert Barr, <rbarr@cisco.com>

Subject: RFC 2026 statement re draft-hakala-diameter-credit-control-XX.txt

Cisco has a pending patent application related to the subject matter of
"Diameter Credit Control Application"
<draft-hakala-diameter-credit-control-XX.txt>.

If technology in this document is included in a standard adopted by the
IETF and any claims of any Cisco patents are necessary for practicing
this standard, any party will be able to obtain a license from Cisco to use
any such patent claims under reasonable, non-discriminatory terms to
implement and fully comply with the standard.

For information contact:

Robert Barr
Worldwide Patent Counsel
Cisco Systems
408-525-9706
rbarr@cisco.com