| 2019-02-11 |
MsgOut
|
Jenny Bui
|
Response due 2019-03-13
Date: 2019-02-11 16:02:51+00:00
From: IETF Secretariat <ietf-ipr@ietf.org>
To: draft-ietf-dime-capablities-update@ietf.org
Subject: IPR Disclosure Huawei Technologies Co.,Ltd's Statement about IPR related to RFC 6737
Cc: dime@ietf.org,
ipr-announce@ietf.org
Dear Glen Zorn, Jiao Kang:
An IPR disclosure that pertains to your RFC entitled "The Diameter
Capabilities Update Application" (RFC6737) was submitted to the IETF
Secretariat on and has been posted on the "IETF Page of Intellectual
Property Rights Disclosures" (https://datatracker.ietf.org/ipr/3421/). The
title of the IPR disclosure is "Huawei Technologies Co.,Ltd's Statement
about IPR related to RFC 6737"
Thank you
IETF Secretariat
|
| 2019-02-11 |
MsgOut
|
Jenny Bui
|
Response due 2019-03-13
Date: 2019-02-11 16:02:51+00:00
From: IETF Secretariat <ietf-ipr@ietf.org>
To: licensing@huawei.com
Subject: Posting of IPR Disclosure
Cc:
Dear Director of licensing:
Your IPR disclosure entitled Huawei Technologies Co.,Ltd's Statement about IPR related to RFC 6737
has been posted on the "IETF Page of Intellectual Property Rights Disclosures"
(https://datatracker.ietf.org/ipr/).
Thank you
IETF Secretariat
|