History for IPR disclosure
Huawei Technologies Co.,Ltd's Statement about IPR related to RFC 6737

Date Type By Text
2019-02-11 MsgOut Jenny Bui Date: 2019-02-11 08:02:51
From: IETF Secretariat <ietf-ipr@ietf.org>
To: draft-ietf-dime-capablities-update@ietf.org
Subject: IPR Disclosure Huawei Technologies Co.,Ltd's Statement about IPR related to RFC 6737
Cc: dime@ietf.org,
    ipr-announce@ietf.org

Dear Glen Zorn, Jiao Kang:

An IPR disclosure that pertains to your RFC entitled "The Diameter
Capabilities Update Application" (RFC6737) was submitted to the IETF
Secretariat on  and has been posted on the "IETF Page of Intellectual
Property Rights Disclosures" (https://datatracker.ietf.org/ipr/3421/). The
title of the IPR disclosure is "Huawei Technologies Co.,Ltd's Statement
about IPR related to RFC 6737"

Thank you

IETF Secretariat

Response Due: 2019-03-13
2019-02-11 MsgOut Jenny Bui Date: 2019-02-11 08:02:51
From: IETF Secretariat <ietf-ipr@ietf.org>
To: licensing@huawei.com
Subject: Posting of IPR Disclosure
Cc:

Dear Director of licensing:

Your IPR disclosure entitled Huawei Technologies Co.,Ltd's Statement about IPR related to RFC 6737
has been posted on the "IETF Page of Intellectual Property Rights Disclosures"
(https://datatracker.ietf.org/ipr/).

Thank you

IETF Secretariat
Response Due: 2019-03-13
2019-02-11 Posted Jenny Bui Disclosure Posted
2019-02-10 Submitted (System) Disclosure Submitted