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The material posted as IPR disclosures should be viewed as originating from the source of that information, and any issue or question related to the material should be directed to the source rather than the IETF. There is no implied endorsement or agreement by the IETF, the IESG or any other IETF entities with any of the material.

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Document IPR search results
rfc5866

Total number of IPR disclosures found: 1.

Date ID Statement
2010-06-23 1344 Huawei Technologies Co.,Ltd's Statement about IPR related to RFC 5866

Total number of documents searched: 2.

Date ID Statement
Results for RFC 5866 ("Diameter Quality-of-Service Application")
2010-06-23 1344 Huawei Technologies Co.,Ltd's Statement about IPR related to RFC 5866
Results for draft-ietf-dime-diameter-qos ("Diameter Quality-of-Service Application"), which became rfc RFC 5866 ("Diameter Quality-of-Service Application")
No IPR disclosures have been submitted directly on draft-ietf-dime-diameter-qos, but there are disclosures on a related document, listed on this page.

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